Compositional dependence of Sn-Zn solder on the intermetallic compound (IMC) growth kinetics with Cu at thin film scales
The development of lead-free solders in microelectronics packaging industry attracts both manufacturers and researchers to study the effect of alloying elements to the reliability of solder joint. One of the most important factors to be examined is the growth of intermetallic compound (IMC) layer in...
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sg-ntu-dr.10356-522442023-03-04T15:43:29Z Compositional dependence of Sn-Zn solder on the intermetallic compound (IMC) growth kinetics with Cu at thin film scales Hidajat, Vincent Sebastian. Gan Chee Lip School of Materials Science and Engineering DRNTU::Engineering The development of lead-free solders in microelectronics packaging industry attracts both manufacturers and researchers to study the effect of alloying elements to the reliability of solder joint. One of the most important factors to be examined is the growth of intermetallic compound (IMC) layer in the interfacial region between conductor metal and solder alloy. By studying the thermodynamic and kinetic aspects of the IMC layer, one can compare the interfacial activities between different device packages under a given environmental condition. In this project, the effect of zinc concentration to the growth of IMC in Cu/Sn-Zn system was evaluated. The conventional ex-situ heating followed by cross-section analysis not only suffers in accuracy, but the experimental setup is also tedious. A simple yet efficient method to quickly investigate IMC growth kinetics in Cu/Sn-Zn system was demonstrated in this study. By observing the optical colour change of copper, one can quickly evaluate the growth kinetics of intermetallic layer. From our experiment, we found that the addition of zinc replaces the growth of Cu6Sn5 and Cu3Sn IMC layers into a single Cu5Zn8 layer. The threshold concentration was found to be 2%at zinc for it to be the main diffusing species in Cu/Sn-Zn system. We also concluded that Cu5Zn8 IMC layer has a lower activation energy than the former Cu-Sn IMC layers. However, as zinc concentration is increased further, the diffusion rate of solder increases and thus accelerates the formation of Cu5Zn8 IMC layer. Therefore, Zn content in the solder has to be carefully controlled to allow the fastest/slowest IMC growth in the solder joint. Bachelor of Engineering (Materials Engineering) 2013-04-25T08:37:41Z 2013-04-25T08:37:41Z 2013 2013 Final Year Project (FYP) http://hdl.handle.net/10356/52244 en Nanyang Technological University 49 p. application/pdf |
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DRNTU::Engineering Hidajat, Vincent Sebastian. Compositional dependence of Sn-Zn solder on the intermetallic compound (IMC) growth kinetics with Cu at thin film scales |
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The development of lead-free solders in microelectronics packaging industry attracts both manufacturers and researchers to study the effect of alloying elements to the reliability of solder joint. One of the most important factors to be examined is the growth of intermetallic compound (IMC) layer in the interfacial region between conductor metal and solder alloy. By studying the thermodynamic and kinetic aspects of the IMC layer, one can compare the interfacial activities between different device packages under a given environmental condition.
In this project, the effect of zinc concentration to the growth of IMC in Cu/Sn-Zn system was evaluated. The conventional ex-situ heating followed by cross-section analysis not only suffers in accuracy, but the experimental setup is also tedious. A simple yet efficient method to quickly investigate IMC growth kinetics in Cu/Sn-Zn system was demonstrated in this study. By observing the optical colour change of copper, one can quickly evaluate the growth kinetics of intermetallic layer.
From our experiment, we found that the addition of zinc replaces the growth of Cu6Sn5 and Cu3Sn IMC layers into a single Cu5Zn8 layer. The threshold concentration was found to be 2%at zinc for it to be the main diffusing species in Cu/Sn-Zn system. We also concluded that Cu5Zn8 IMC layer has a lower activation energy than the former Cu-Sn IMC layers. However, as zinc concentration is increased further, the diffusion rate of solder increases and thus accelerates the formation of Cu5Zn8 IMC layer. Therefore, Zn content in the solder has to be carefully controlled to allow the fastest/slowest IMC growth in the solder joint. |
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Gan Chee Lip |
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Gan Chee Lip Hidajat, Vincent Sebastian. |
format |
Final Year Project |
author |
Hidajat, Vincent Sebastian. |
author_sort |
Hidajat, Vincent Sebastian. |
title |
Compositional dependence of Sn-Zn solder on the intermetallic compound (IMC) growth kinetics with Cu at thin film scales |
title_short |
Compositional dependence of Sn-Zn solder on the intermetallic compound (IMC) growth kinetics with Cu at thin film scales |
title_full |
Compositional dependence of Sn-Zn solder on the intermetallic compound (IMC) growth kinetics with Cu at thin film scales |
title_fullStr |
Compositional dependence of Sn-Zn solder on the intermetallic compound (IMC) growth kinetics with Cu at thin film scales |
title_full_unstemmed |
Compositional dependence of Sn-Zn solder on the intermetallic compound (IMC) growth kinetics with Cu at thin film scales |
title_sort |
compositional dependence of sn-zn solder on the intermetallic compound (imc) growth kinetics with cu at thin film scales |
publishDate |
2013 |
url |
http://hdl.handle.net/10356/52244 |
_version_ |
1759855861882159104 |