Compositional dependence of Sn-Zn solder on the intermetallic compound (IMC) growth kinetics with Cu at thin film scales
The development of lead-free solders in microelectronics packaging industry attracts both manufacturers and researchers to study the effect of alloying elements to the reliability of solder joint. One of the most important factors to be examined is the growth of intermetallic compound (IMC) layer in...
Saved in:
Main Author: | Hidajat, Vincent Sebastian. |
---|---|
Other Authors: | Gan Chee Lip |
Format: | Final Year Project |
Language: | English |
Published: |
2013
|
Subjects: | |
Online Access: | http://hdl.handle.net/10356/52244 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Institution: | Nanyang Technological University |
Language: | English |
Similar Items
-
Compositional dependence of Sn-Bi solder on the intermetallic compound (IMC) growth kinetics with Cu at thin film scales
by: Zhou, Yingxiu.
Published: (2013) -
Morphology and mechanical properties of intermetallic compounds in SnAgCu solder joints
by: Chandra Rao, B.S.S., et al.
Published: (2014) -
Suppressing intermetallic compound growth in SnAgCu solder joints with addition of carbon nanotubes
by: Nai, S.M.L., et al.
Published: (2014) -
Effect of amount of Cu on the intermetallic layer thickness between Sn-Cu solders and Cu substrates
by: Alam, M.E., et al.
Published: (2014) -
Fracture toughness of Cu-Sn intermetallic thin films
by: Li, M., et al.
Published: (2012)