Compositional dependence of Sn-Zn solder on the intermetallic compound (IMC) growth kinetics with Cu at thin film scales

• المؤلف الرئيسي: Hidajat, Vincent Sebastian.
• مؤلفون آخرون: Gan Chee Lip
• التنسيق: Final Year Project
• اللغة: English
• منشور في: 2013
• الموضوعات: DRNTU::Engineering
• الوصول للمادة أونلاين: http://hdl.handle.net/10356/52244
• المؤسسة: Nanyang Technological University

The development of lead-free solders in microelectronics packaging industry attracts both manufacturers and researchers to study the effect of alloying elements to the reliability of solder joint. One of the most important factors to be examined is the growth of intermetallic compound (IMC) layer in...