Parametric studies and design of cushion packaging buffers for drop impact

Parametric studies and design of cushion packaging buffers for drop impact

In this project, a finite element modeling procedure for performing a virtual product-package drop test is successfully established. The drop test simulation using FEA is done using ANSYS/LS-DYNA. An improved cushion design procedure has been proposed.

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書目詳細資料
主要作者:	Mohamed Isa Thameem Ansari.
其他作者:	Lye, Sun Woh
格式:	Theses and Dissertations
出版:	2008
主題:	DRNTU::Engineering::Manufacturing::Product engineering
在線閱讀:	http://hdl.handle.net/10356/5257
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!

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