Characterization of semiconductor process parameters
Silicon, being the most mature technology in the electronics industry, is facing limitations and challenges that threaten to displace Moore’s Law as device sizes get increasingly smaller. The monolithic integration of III-V to Silicon via wafer bonding will marry the advantages of both platforms for...
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Format: | Final Year Project |
Language: | English |
Published: |
2013
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Online Access: | http://hdl.handle.net/10356/53005 |
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Institution: | Nanyang Technological University |
Language: | English |