Characterization of semiconductor process parameters

Silicon, being the most mature technology in the electronics industry, is facing limitations and challenges that threaten to displace Moore’s Law as device sizes get increasingly smaller. The monolithic integration of III-V to Silicon via wafer bonding will marry the advantages of both platforms for...

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Bibliographic Details
Main Author: Gan, Chin Ngap
Other Authors: Yoon Soon Fatt
Format: Final Year Project
Language:English
Published: 2013
Subjects:
Online Access:http://hdl.handle.net/10356/53005
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Institution: Nanyang Technological University
Language: English

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