Characterization of aluminium pad under different process conditions

Characterization of aluminium pad under different process conditions

The objective of this study is to improve the aluminum film uniformity by optimizing the process condition. The aluminum film was deposited by a sputtering process on 200mm wafers in AMAT Endura® PVD chambers.

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Bibliographic Details
Main Author: Wang, Jian Hua.
Other Authors: Zhong, Zhaowei
Format: Theses and Dissertations
Published: 2008
Subjects:
DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films
Online Access:http://hdl.handle.net/10356/5340
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Institution: Nanyang Technological University
Description
Summary:The objective of this study is to improve the aluminum film uniformity by optimizing the process condition. The aluminum film was deposited by a sputtering process on 200mm wafers in AMAT Endura® PVD chambers.

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