Characterization of aluminium pad under different process conditions

• المؤلف الرئيسي: Wang, Jian Hua.
• مؤلفون آخرون: Zhong, Zhaowei
• التنسيق: Theses and Dissertations
• منشور في: 2008
• الموضوعات: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films
• الوصول للمادة أونلاين: http://hdl.handle.net/10356/5340

The objective of this study is to improve the aluminum film uniformity by optimizing the process condition. The aluminum film was deposited by a sputtering process on 200mm wafers in AMAT Endura® PVD chambers.