Characterization of aluminium pad under different process conditions

• Main Author: Wang, Jian Hua.
• Other Authors: Zhong, Zhaowei
• Format: Theses and Dissertations
• Published: 2008
• Subjects: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films
• Online Access: http://hdl.handle.net/10356/5340
• Institution: Nanyang Technological University

The objective of this study is to improve the aluminum film uniformity by optimizing the process condition. The aluminum film was deposited by a sputtering process on 200mm wafers in AMAT Endura® PVD chambers.