Ultrasonic characterisation of interfaces in IC packaging
The study demonstrates that the quantification evaluation of the interface quality is possible, and oblique reflection coefficient can be used as a criterion for its better sensitivity. The result is also applicable to interfaces in other IC packaging configurations since the interface studied in th...
Saved in:
| Main Author: | |
|---|---|
| Other Authors: | |
| Format: | Theses and Dissertations |
| Published: |
2008
|
| Subjects: | |
| Online Access: | https://hdl.handle.net/10356/5365 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| Institution: | Nanyang Technological University |
| Summary: | The study demonstrates that the quantification evaluation of the interface quality is possible, and oblique reflection coefficient can be used as a criterion for its better sensitivity. The result is also applicable to interfaces in other IC packaging configurations since the interface studied in this work is very generic. |
|---|