Ultrasonic characterisation of interfaces in IC packaging

The study demonstrates that the quantification evaluation of the interface quality is possible, and oblique reflection coefficient can be used as a criterion for its better sensitivity. The result is also applicable to interfaces in other IC packaging configurations since the interface studied in th...

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Bibliographic Details
Main Author:	Wang, Yi
Other Authors:	Guo Ningqun
Format:	Theses and Dissertations
Published:	2008
Subjects:	DRNTU::Engineering::Manufacturing
Online Access:	https://hdl.handle.net/10356/5365
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Institution:	Nanyang Technological University

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spelling	sg-ntu-dr.10356-53652023-03-11T17:48:54Z Ultrasonic characterisation of interfaces in IC packaging Wang, Yi Guo Ningqun School of Mechanical and Aerospace Engineering DRNTU::Engineering::Manufacturing The study demonstrates that the quantification evaluation of the interface quality is possible, and oblique reflection coefficient can be used as a criterion for its better sensitivity. The result is also applicable to interfaces in other IC packaging configurations since the interface studied in this work is very generic. DOCTOR OF PHILOSOPHY (MPE) 2008-09-17T10:48:55Z 2008-09-17T10:48:55Z 2005 2005 Thesis Wang, Y. (2005). Ultrasonic characterisation of interfaces in IC packaging. Doctoral thesis, Nanyang Technological University, Singapore. https://hdl.handle.net/10356/5365 10.32657/10356/5365 Nanyang Technological University application/pdf
institution	Nanyang Technological University
building	NTU Library
continent	Asia
country	Singapore Singapore
content_provider	NTU Library
collection	DR-NTU
topic	DRNTU::Engineering::Manufacturing
spellingShingle	DRNTU::Engineering::Manufacturing Wang, Yi Ultrasonic characterisation of interfaces in IC packaging
description	The study demonstrates that the quantification evaluation of the interface quality is possible, and oblique reflection coefficient can be used as a criterion for its better sensitivity. The result is also applicable to interfaces in other IC packaging configurations since the interface studied in this work is very generic.
author2	Guo Ningqun
author_facet	Guo Ningqun Wang, Yi
format	Theses and Dissertations
author	Wang, Yi
author_sort	Wang, Yi
title	Ultrasonic characterisation of interfaces in IC packaging
title_short	Ultrasonic characterisation of interfaces in IC packaging
title_full	Ultrasonic characterisation of interfaces in IC packaging
title_fullStr	Ultrasonic characterisation of interfaces in IC packaging
title_full_unstemmed	Ultrasonic characterisation of interfaces in IC packaging
title_sort	ultrasonic characterisation of interfaces in ic packaging
publishDate	2008
url	https://hdl.handle.net/10356/5365
_version_	1761781458139086848

Ultrasonic characterisation of interfaces in IC packaging

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