Ultrasonic characterisation of interfaces in IC packaging
The study demonstrates that the quantification evaluation of the interface quality is possible, and oblique reflection coefficient can be used as a criterion for its better sensitivity. The result is also applicable to interfaces in other IC packaging configurations since the interface studied in th...
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| Format: | Theses and Dissertations |
| Published: |
2008
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| Online Access: | https://hdl.handle.net/10356/5365 |
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| Institution: | Nanyang Technological University |