Study of solder joints for ball grid array (BGA) assembly

This thesis aims to study failure characteristics of solder joints (10Sn/90Pb solder ball and eutetic Sn-Pb solder fillet) in Ceramic Ball Grid Array (CBGA) and assembly, and investigate the effect of Accelerated Thermal Cycling (ATC) and reflow atmosphere on joint failure. Metallographic sections a...

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Bibliographic Details
Main Author: Yam, Shong Wai
Other Authors: Wong, Brian Stephen
Format: Theses and Dissertations
Published: 2008
Subjects:
Online Access:http://hdl.handle.net/10356/5442
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Institution: Nanyang Technological University
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