Transient liquid phase bonding using Ni/Sn multilayers for high temperature applications

With growing demand in electronic system for operating in harsh conditions makes the idea of research focus more on a reliable and resilient packaging of the interconnect components. The components of these devices are subjected to wide range of temperatures therefore the reliability and resilience...

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Main Author: Melvin
Other Authors: Chen Zhong
Format: Final Year Project
Language:English
Published: 2014
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Online Access:http://hdl.handle.net/10356/55856
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Institution: Nanyang Technological University
Language: English
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spelling sg-ntu-dr.10356-558562023-03-04T15:43:32Z Transient liquid phase bonding using Ni/Sn multilayers for high temperature applications Melvin Chen Zhong School of Materials Science and Engineering Advanced Materials Research Centre DRNTU::Engineering With growing demand in electronic system for operating in harsh conditions makes the idea of research focus more on a reliable and resilient packaging of the interconnect components. The components of these devices are subjected to wide range of temperatures therefore the reliability and resilience of the components must be sufficient to produce a device with an acceptable lifetime. Some conventional solder joints have been experimented but they were proven to have a lower melting point than the service temperature, making them become inappropriate candidates for high-temperature applications. Consequently, a new bonding method which incorporated both dissolution bonding and diffusion bonding i.e. Transient Liquid Phase (TLP) bonding is developed for addressing this issue. Moreover, its benefits to produce high quality bond at lower processing temperature has made this method as a prominent method particularly for bonding metallurgical systems. Nickel-Tin (Ni-Sn) metal system was proposed as a die-attach solution for high-temperature applications since it was cost effective, high remelting temperature and compatible with manufacturing process. In this project, Ni-Sn metal system was fabricated using TLP bonding and further studies were carried out to investigate its shear strength reliability both at room temperature and elevated temperature. In addition, influence of thickness of Ni and Sn layers and aging treatment on the joint strength were also discussed. Developed TLP joints were taken for die-shear test for testing the mechanical strength of the joint. Increasing joint strength was observed given an increase in Ni and Sn layers. Microstructural changes as a result of aging treatment were also analyzed by SEM and EDX. X-Ray analysis showed no occurrences of voids and the joint merely consisted of Ni and Ni3Sn4 layers. From shear strength evaluation, Ni-Sn TLP of thicker Ni and Sn layers met the minimum shear strength for high temperature applications as die attach bond under room temperature service. On the other side, aging treatment at 100 hour showed the formation of thicker Ni3Sn4 layer and the presence of abundant oxygen concentration at the joint area which resulted in joint strength reduction. Moreover, at 200-hour aging time, thinning of Ni3Sn4 layer was observed along with the absence of oxygen molecules at the joint area which further exacerbated the quality of TLP joint. Bachelor of Engineering (Materials Engineering) 2014-04-03T02:29:39Z 2014-04-03T02:29:39Z 2014 2014 Final Year Project (FYP) http://hdl.handle.net/10356/55856 en Nanyang Technological University 49 p. application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
language English
topic DRNTU::Engineering
spellingShingle DRNTU::Engineering
Melvin
Transient liquid phase bonding using Ni/Sn multilayers for high temperature applications
description With growing demand in electronic system for operating in harsh conditions makes the idea of research focus more on a reliable and resilient packaging of the interconnect components. The components of these devices are subjected to wide range of temperatures therefore the reliability and resilience of the components must be sufficient to produce a device with an acceptable lifetime. Some conventional solder joints have been experimented but they were proven to have a lower melting point than the service temperature, making them become inappropriate candidates for high-temperature applications. Consequently, a new bonding method which incorporated both dissolution bonding and diffusion bonding i.e. Transient Liquid Phase (TLP) bonding is developed for addressing this issue. Moreover, its benefits to produce high quality bond at lower processing temperature has made this method as a prominent method particularly for bonding metallurgical systems. Nickel-Tin (Ni-Sn) metal system was proposed as a die-attach solution for high-temperature applications since it was cost effective, high remelting temperature and compatible with manufacturing process. In this project, Ni-Sn metal system was fabricated using TLP bonding and further studies were carried out to investigate its shear strength reliability both at room temperature and elevated temperature. In addition, influence of thickness of Ni and Sn layers and aging treatment on the joint strength were also discussed. Developed TLP joints were taken for die-shear test for testing the mechanical strength of the joint. Increasing joint strength was observed given an increase in Ni and Sn layers. Microstructural changes as a result of aging treatment were also analyzed by SEM and EDX. X-Ray analysis showed no occurrences of voids and the joint merely consisted of Ni and Ni3Sn4 layers. From shear strength evaluation, Ni-Sn TLP of thicker Ni and Sn layers met the minimum shear strength for high temperature applications as die attach bond under room temperature service. On the other side, aging treatment at 100 hour showed the formation of thicker Ni3Sn4 layer and the presence of abundant oxygen concentration at the joint area which resulted in joint strength reduction. Moreover, at 200-hour aging time, thinning of Ni3Sn4 layer was observed along with the absence of oxygen molecules at the joint area which further exacerbated the quality of TLP joint.
author2 Chen Zhong
author_facet Chen Zhong
Melvin
format Final Year Project
author Melvin
author_sort Melvin
title Transient liquid phase bonding using Ni/Sn multilayers for high temperature applications
title_short Transient liquid phase bonding using Ni/Sn multilayers for high temperature applications
title_full Transient liquid phase bonding using Ni/Sn multilayers for high temperature applications
title_fullStr Transient liquid phase bonding using Ni/Sn multilayers for high temperature applications
title_full_unstemmed Transient liquid phase bonding using Ni/Sn multilayers for high temperature applications
title_sort transient liquid phase bonding using ni/sn multilayers for high temperature applications
publishDate 2014
url http://hdl.handle.net/10356/55856
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