Transient liquid phase bonding using Ni/Sn multilayers for high temperature applications

• Main Author: Melvin
• Other Authors: Chen Zhong
• Format: Final Year Project
• Language: English
• Published: 2014
• Subjects: DRNTU::Engineering
• Online Access: http://hdl.handle.net/10356/55856
• Institution: Nanyang Technological University

With growing demand in electronic system for operating in harsh conditions makes the idea of research focus more on a reliable and resilient packaging of the interconnect components. The components of these devices are subjected to wide range of temperatures therefore the reliability and resilience...