Transient liquid phase bonding using Ni/Sn multilayers for high temperature applications

• المؤلف الرئيسي: Melvin
• مؤلفون آخرون: Chen Zhong
• التنسيق: Final Year Project
• اللغة: English
• منشور في: 2014
• الموضوعات: DRNTU::Engineering
• الوصول للمادة أونلاين: http://hdl.handle.net/10356/55856
• المؤسسة: Nanyang Technological University

With growing demand in electronic system for operating in harsh conditions makes the idea of research focus more on a reliable and resilient packaging of the interconnect components. The components of these devices are subjected to wide range of temperatures therefore the reliability and resilience...