Transient liquid phase bonding using Ni/Sn multilayers for high temperature applications

• 主要作者: Melvin
• 其他作者: Chen Zhong
• 格式: Final Year Project
• 語言: English
• 出版: 2014
• 主題: DRNTU::Engineering
• 在線閱讀: http://hdl.handle.net/10356/55856

With growing demand in electronic system for operating in harsh conditions makes the idea of research focus more on a reliable and resilient packaging of the interconnect components. The components of these devices are subjected to wide range of temperatures therefore the reliability and resilience...