Moire measurement of IC packages

Flip-chip components have been studied under thermal-cycles. An ultra sensitive displacement measuring technique Moire interferometry was used to investigate this phenomenon. The Moire interferometer was incorporated with a heating chamber whereby the real-time observation of the thermal-cycle proce...

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書目詳細資料
主要作者: Huang, Xia.
其他作者: Yi, Sung
格式: Theses and Dissertations
出版: 2008
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在線閱讀:http://hdl.handle.net/10356/5804
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