Exploring & enhancing the possibilities of accelerated life testing of semiconductor components and transfer to mass production
This project focuses on the possibilities of enhancing the accelerated life testing of semiconductor interconnects. A reliable evaluation and measurement technique is developed, based on online monitoring of electrical parameters with high measuring resolution. Local monitoring of temperature and hu...
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| Main Authors: | , , |
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| Other Authors: | |
| Format: | Theses and Dissertations |
| Language: | English |
| Published: |
2014
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| Subjects: | |
| Online Access: | http://hdl.handle.net/10356/60715 |
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| Institution: | Nanyang Technological University |
| Language: | English |
| Summary: | This project focuses on the possibilities of enhancing the accelerated life testing of semiconductor interconnects. A reliable evaluation and measurement technique is developed, based on online monitoring of electrical parameters with high measuring resolution. Local monitoring of temperature and humidity with increased sampling rate provides a higher resolution and is far more effective in understanding the degradation mechanisms of semiconductor interconnects. Thus the new system provides a good predictive capability of the Mean Time to Failure (MTF) of adhesive interconnects. Also the present system isn't friendly enough for data handling and interpretation. Hence separate programs called - 'Real World & Deeper Analysis' have been developed for easy data handling and analysis. |
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