Exploring & enhancing the possibilities of accelerated life testing of semiconductor components and transfer to mass production

• Main Authors: N. B. Vignesh, Zhong, Yi, Che, Yi
• Other Authors: Yue Chee Yoon
• Format: Theses and Dissertations
• Language: English
• Published: 2014
• Subjects: DRNTU::Engineering::Manufacturing
• Online Access: http://hdl.handle.net/10356/60715
• Institution: Nanyang Technological University

This project focuses on the possibilities of enhancing the accelerated life testing of semiconductor interconnects. A reliable evaluation and measurement technique is developed, based on online monitoring of electrical parameters with high measuring resolution. Local monitoring of temperature and humidity with increased sampling rate provides a higher resolution and is far more effective in understanding the degradation mechanisms of semiconductor interconnects. Thus the new system provides a good predictive capability of the Mean Time to Failure (MTF) of adhesive interconnects. Also the present system isn't friendly enough for data handling and interpretation. Hence separate programs called - 'Real World & Deeper Analysis' have been developed for easy data handling and analysis.