Analysis of heat dissipation and thermal enhancements in electronic packages

In this study, thermal characterization is carried out under natural and forced cooling conditions for four kinds of electronic packages.

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Bibliographic Details
Main Author:	Loh, Chiah Vern.
Other Authors:	Chan, Yiu Wing
Format:	Theses and Dissertations
Published:	2008
Subjects:	DRNTU::Engineering::Manufacturing
Online Access:	http://hdl.handle.net/10356/6087
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Institution:	Nanyang Technological University

id	sg-ntu-dr.10356-6087
record_format	dspace
spelling	sg-ntu-dr.10356-60872023-03-11T17:08:30Z Analysis of heat dissipation and thermal enhancements in electronic packages Loh, Chiah Vern. Chan, Yiu Wing School of Mechanical and Production Engineering Toh, Kok Chuan DRNTU::Engineering::Manufacturing In this study, thermal characterization is carried out under natural and forced cooling conditions for four kinds of electronic packages. Master of Engineering (MPE) 2008-09-17T11:06:28Z 2008-09-17T11:06:28Z 2001 2001 Thesis http://hdl.handle.net/10356/6087 Nanyang Technological University application/pdf
institution	Nanyang Technological University
building	NTU Library
continent	Asia
country	Singapore Singapore
content_provider	NTU Library
collection	DR-NTU
topic	DRNTU::Engineering::Manufacturing
spellingShingle	DRNTU::Engineering::Manufacturing Loh, Chiah Vern. Analysis of heat dissipation and thermal enhancements in electronic packages
description	In this study, thermal characterization is carried out under natural and forced cooling conditions for four kinds of electronic packages.
author2	Chan, Yiu Wing
author_facet	Chan, Yiu Wing Loh, Chiah Vern.
format	Theses and Dissertations
author	Loh, Chiah Vern.
author_sort	Loh, Chiah Vern.
title	Analysis of heat dissipation and thermal enhancements in electronic packages
title_short	Analysis of heat dissipation and thermal enhancements in electronic packages
title_full	Analysis of heat dissipation and thermal enhancements in electronic packages
title_fullStr	Analysis of heat dissipation and thermal enhancements in electronic packages
title_full_unstemmed	Analysis of heat dissipation and thermal enhancements in electronic packages
title_sort	analysis of heat dissipation and thermal enhancements in electronic packages
publishDate	2008
url	http://hdl.handle.net/10356/6087
_version_	1761782095479308288

Analysis of heat dissipation and thermal enhancements in electronic packages

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