Analysis of heat dissipation and thermal enhancements in electronic packages
In this study, thermal characterization is carried out under natural and forced cooling conditions for four kinds of electronic packages.
Saved in:
| Main Author: | |
|---|---|
| Other Authors: | |
| Format: | Theses and Dissertations |
| Published: |
2008
|
| Subjects: | |
| Online Access: | http://hdl.handle.net/10356/6087 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| Institution: | Nanyang Technological University |
Be the first to leave a comment!