Bonding technology for semiconductor wafers and structures

• Main Author: Chew, Zong Hui
• Other Authors: Yoon, Soon Fatt
• Format: Final Year Project
• Language: English
• Published: 2014
• Subjects: DRNTU::Engineering
• Online Access: http://hdl.handle.net/10356/61326
• Institution: Nanyang Technological University

Silicon had been a dominant material in the Very Large Scale Integration (VLSI) technology which are commonly used in microprocessors and memory devices. Most III- IV compound semiconductor are direct bandgap materials and are commonly used in optoelectronic application such as in Light Emitting Dio...