Bonding technology for semiconductor wafers and structures

Silicon had been a dominant material in the Very Large Scale Integration (VLSI) technology which are commonly used in microprocessors and memory devices. Most III- IV compound semiconductor are direct bandgap materials and are commonly used in optoelectronic application such as in Light Emitting Dio...

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Bibliographic Details
Main Author: Chew, Zong Hui
Other Authors: Yoon, Soon Fatt
Format: Final Year Project
Language:English
Published: 2014
Subjects:
Online Access:http://hdl.handle.net/10356/61326
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Institution: Nanyang Technological University
Language: English

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