Bonding technology for semiconductor wafers and structures

• 主要作者: Chew, Zong Hui
• 其他作者: Yoon, Soon Fatt
• 格式: Final Year Project
• 語言: English
• 出版: 2014
• 主題: DRNTU::Engineering
• 在線閱讀: http://hdl.handle.net/10356/61326
• 機構: Nanyang Technological University

Silicon had been a dominant material in the Very Large Scale Integration (VLSI) technology which are commonly used in microprocessors and memory devices. Most III- IV compound semiconductor are direct bandgap materials and are commonly used in optoelectronic application such as in Light Emitting Dio...