Through-silicon-via (TSV) design, fabrication and characterization for 3D IC applications
Three-dimensional (3D) integration is identified as a key and promising path, not only to facilitate the continuation of the conventional scaling, but also to enable the “More-than- Moore” heterogeneous integration of a vast different functionalities into a system in a single chip form. By using 3D...
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| Format: | Theses and Dissertations |
| Language: | English |
| Published: |
2014
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| Online Access: | https://hdl.handle.net/10356/61734 |
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| Institution: | Nanyang Technological University |
| Language: | English |