Through-silicon-via (TSV) design, fabrication and characterization for 3D IC applications

Three-dimensional (3D) integration is identified as a key and promising path, not only to facilitate the continuation of the conventional scaling, but also to enable the “More-than- Moore” heterogeneous integration of a vast different functionalities into a system in a single chip form. By using 3D...

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Bibliographic Details
Main Author: Zhang, Lin
Other Authors: Li Hong Yu
Format: Theses and Dissertations
Language:English
Published: 2014
Subjects:
Online Access:https://hdl.handle.net/10356/61734
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Institution: Nanyang Technological University
Language: English
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