Fundamental studies of high-aspect ratio UV embossing of poly(ethylene glycol)
Two critical aspects determining if the embossed polymer could be demolded cleanly are the mold-resin chemical interaction, and the conversion and shrinkage upon curing. This thesis examines the fundamentals of these physical processes using PEG as the base material.
Saved in:
Main Author: | Neo, Wee Koon |
---|---|
Other Authors: | Chan, Mary Bee Eng |
Format: | Theses and Dissertations |
Published: |
2008
|
Subjects: | |
Online Access: | https://hdl.handle.net/10356/6188 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Institution: | Nanyang Technological University |
Similar Items
-
Fundamental studies of large area and high aspect ratio UV embossing
by: Zhou, Wenxiu
Published: (2008) -
A project study on the manufacture of ethylene glycol from ethylene
by: Torres, Hector B.
Published: (1968) -
Micellization and thermogelation of poly(ether urethane)s comprising poly(ethylene glycol) and poly(propylene glycol)
by: Loh, X.J., et al.
Published: (2014) -
Voltage activation of poly (ethylene glycol) diacrylate
by: Ghosh, Animesh, et al.
Published: (2022) -
Hot-embossing of polymeric micro-structures devices
by: Teo, Benjamin Qingliang.
Published: (2009)