Development of failure criterion and reliability model for plastic encapsulated microcircuits at elevated environment

• المؤلف الرئيسي: Poon, Wai Kiong.
• مؤلفون آخرون: Ang, Hock Eng
• التنسيق: Theses and Dissertations
• منشور في: 2008
• الموضوعات: DRNTU::Engineering::Manufacturing::Product engineering
• الوصول للمادة أونلاين: http://hdl.handle.net/10356/6280

The strength of the interfaces between dissimilar materials that make up an electronic component has important consequence on its failure mechanism. The mechanical integrity of such devices is thus determined by a material property that characterizes the resistance of material interface to fracture....