Development of failure criterion and reliability model for plastic encapsulated microcircuits at elevated environment
The strength of the interfaces between dissimilar materials that make up an electronic component has important consequence on its failure mechanism. The mechanical integrity of such devices is thus determined by a material property that characterizes the resistance of material interface to fracture....
Saved in:
Main Author: | Poon, Wai Kiong. |
---|---|
Other Authors: | Ang, Hock Eng |
Format: | Theses and Dissertations |
Published: |
2008
|
Subjects: | |
Online Access: | http://hdl.handle.net/10356/6280 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Institution: | Nanyang Technological University |
Similar Items
-
Development of a chip-on-tape encapsulation process
by: Mui, Yew Cheong.
Published: (2009) -
Package reliability modeling and design analysis of bio-sensors
by: Lim, Bee Huan.
Published: (2008) -
Research and development of advanced engineering mechanics technology for design and manufacturing of plastic encapsulated integrated circuits
by: Xiao, Zhongmin
Published: (2008) -
Crack prediction of plastic housing subjected to impact loading
by: Teo, Chung Kiat
Published: (2008) -
Familiarity detection is an intrinsic property of cortical microcircuits with bidirectional synaptic plasticity
by: Zhang X., et al.
Published: (2020)