Development of failure criterion and reliability model for plastic encapsulated microcircuits at elevated environment
The strength of the interfaces between dissimilar materials that make up an electronic component has important consequence on its failure mechanism. The mechanical integrity of such devices is thus determined by a material property that characterizes the resistance of material interface to fracture....
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Main Author: | Poon, Wai Kiong. |
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Other Authors: | Ang, Hock Eng |
Format: | Theses and Dissertations |
Published: |
2008
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Subjects: | |
Online Access: | http://hdl.handle.net/10356/6280 |
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Institution: | Nanyang Technological University |
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