Development of failure criterion and reliability model for plastic encapsulated microcircuits at elevated environment

The strength of the interfaces between dissimilar materials that make up an electronic component has important consequence on its failure mechanism. The mechanical integrity of such devices is thus determined by a material property that characterizes the resistance of material interface to fracture....

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主要作者: Poon, Wai Kiong.
其他作者: Ang, Hock Eng
格式: Theses and Dissertations
出版: 2008
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在線閱讀:http://hdl.handle.net/10356/6280
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