Development of a 3D optical testing system for the study of IC packaging
The main objective of this study is to develop an advanced 3-D optical testing system to measure the deformations of IC packages accurately and comprehensively. The present study consists of two parts: 1) development and construction of an advanced compact 3-D optical testing system; and 2) applicat...
Saved in:
| Main Author: | |
|---|---|
| Other Authors: | |
| Format: | Theses and Dissertations |
| Published: |
2008
|
| Subjects: | |
| Online Access: | http://hdl.handle.net/10356/6408 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| Institution: | Nanyang Technological University |
| id |
sg-ntu-dr.10356-6408 |
|---|---|
| record_format |
dspace |
| spelling |
sg-ntu-dr.10356-64082023-03-11T17:11:03Z Development of a 3D optical testing system for the study of IC packaging Su, Fei. Chian, Kerm Sin School of Mechanical and Production Engineering DRNTU::Engineering::Manufacturing The main objective of this study is to develop an advanced 3-D optical testing system to measure the deformations of IC packages accurately and comprehensively. The present study consists of two parts: 1) development and construction of an advanced compact 3-D optical testing system; and 2) application of the 3-D optical testing system to IC packages for their hygro-thermo-mechanical reliability evaluation. Doctor of Philosophy (MPE) 2008-09-17T11:14:13Z 2008-09-17T11:14:13Z 2004 2004 Thesis http://hdl.handle.net/10356/6408 Nanyang Technological University application/pdf |
| institution |
Nanyang Technological University |
| building |
NTU Library |
| continent |
Asia |
| country |
Singapore Singapore |
| content_provider |
NTU Library |
| collection |
DR-NTU |
| topic |
DRNTU::Engineering::Manufacturing |
| spellingShingle |
DRNTU::Engineering::Manufacturing Su, Fei. Development of a 3D optical testing system for the study of IC packaging |
| description |
The main objective of this study is to develop an advanced 3-D optical testing system to measure the deformations of IC packages accurately and comprehensively. The present study consists of two parts: 1) development and construction of an advanced compact 3-D optical testing system; and 2) application of the 3-D optical testing system to IC packages for their hygro-thermo-mechanical reliability evaluation. |
| author2 |
Chian, Kerm Sin |
| author_facet |
Chian, Kerm Sin Su, Fei. |
| format |
Theses and Dissertations |
| author |
Su, Fei. |
| author_sort |
Su, Fei. |
| title |
Development of a 3D optical testing system for the study of IC packaging |
| title_short |
Development of a 3D optical testing system for the study of IC packaging |
| title_full |
Development of a 3D optical testing system for the study of IC packaging |
| title_fullStr |
Development of a 3D optical testing system for the study of IC packaging |
| title_full_unstemmed |
Development of a 3D optical testing system for the study of IC packaging |
| title_sort |
development of a 3d optical testing system for the study of ic packaging |
| publishDate |
2008 |
| url |
http://hdl.handle.net/10356/6408 |
| _version_ |
1761781630249205760 |