Development of failure assessment methodology for lead-free electronic assembly

In this study, reliability test and analysis methodology for lead-free (Pb-free) soldered assemblies subjected to thermal cycling, cyclic bend, drop impact and vibration loadings are investigated. Finite element analysis (FEA) is used as a numerical modeling tool for simulating solder micro-deformat...

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Bibliographic Details
Main Author:	Che, Fa Xing
Other Authors:	Pang Hock Lye, John
Format:	Theses and Dissertations
Published:	2008
Subjects:	DRNTU::Engineering::Manufacturing
Online Access:	https://hdl.handle.net/10356/6473
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Institution:	Nanyang Technological University

id	sg-ntu-dr.10356-6473
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spelling	sg-ntu-dr.10356-64732023-03-11T18:08:34Z Development of failure assessment methodology for lead-free electronic assembly Che, Fa Xing Pang Hock Lye, John School of Mechanical and Aerospace Engineering DRNTU::Engineering::Manufacturing In this study, reliability test and analysis methodology for lead-free (Pb-free) soldered assemblies subjected to thermal cycling, cyclic bend, drop impact and vibration loadings are investigated. Finite element analysis (FEA) is used as a numerical modeling tool for simulating solder micro-deformation and integrated with solder fatigue failure analysis assessment. In this project, a failure assessment methodology for modeling Pb-free (and Pb-based) soldered assemblies is proposed. DOCTOR OF PHILOSOPHY (MAE) 2008-09-17T11:15:55Z 2008-09-17T11:15:55Z 2006 2006 Thesis Che, F. X. (2006). Development of failure assessment methodology for lead-free electronic assembly. Doctoral thesis, Nanyang Technological University, Singapore. https://hdl.handle.net/10356/6473 10.32657/10356/6473 Nanyang Technological University application/pdf
institution	Nanyang Technological University
building	NTU Library
continent	Asia
country	Singapore Singapore
content_provider	NTU Library
collection	DR-NTU
topic	DRNTU::Engineering::Manufacturing
spellingShingle	DRNTU::Engineering::Manufacturing Che, Fa Xing Development of failure assessment methodology for lead-free electronic assembly
description	In this study, reliability test and analysis methodology for lead-free (Pb-free) soldered assemblies subjected to thermal cycling, cyclic bend, drop impact and vibration loadings are investigated. Finite element analysis (FEA) is used as a numerical modeling tool for simulating solder micro-deformation and integrated with solder fatigue failure analysis assessment. In this project, a failure assessment methodology for modeling Pb-free (and Pb-based) soldered assemblies is proposed.
author2	Pang Hock Lye, John
author_facet	Pang Hock Lye, John Che, Fa Xing
format	Theses and Dissertations
author	Che, Fa Xing
author_sort	Che, Fa Xing
title	Development of failure assessment methodology for lead-free electronic assembly
title_short	Development of failure assessment methodology for lead-free electronic assembly
title_full	Development of failure assessment methodology for lead-free electronic assembly
title_fullStr	Development of failure assessment methodology for lead-free electronic assembly
title_full_unstemmed	Development of failure assessment methodology for lead-free electronic assembly
title_sort	development of failure assessment methodology for lead-free electronic assembly
publishDate	2008
url	https://hdl.handle.net/10356/6473
_version_	1761781668567318528

Development of failure assessment methodology for lead-free electronic assembly

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