Development of failure assessment methodology for lead-free electronic assembly
In this study, reliability test and analysis methodology for lead-free (Pb-free) soldered assemblies subjected to thermal cycling, cyclic bend, drop impact and vibration loadings are investigated. Finite element analysis (FEA) is used as a numerical modeling tool for simulating solder micro-deformat...
Saved in:
| 主要作者: | |
|---|---|
| 其他作者: | |
| 格式: | Theses and Dissertations |
| 出版: |
2008
|
| 主題: | |
| 在線閱讀: | https://hdl.handle.net/10356/6473 |
| 標簽: |
添加標簽
沒有標簽, 成為第一個標記此記錄!
|
| 機構: | Nanyang Technological University |