Studies of gallium nitride high electron mobility transistors

Gallium Nitride (GaN) is a Group III/V wide bandgap nitride-based material that possesses many unique properties, which pushes semiconductor device performances to newer limits. This has been attracting attention in both the engineering field and the commercial semiconductor industry. With the abili...

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التفاصيل البيبلوغرافية
المؤلف الرئيسي: Goh, Basil Yan Kun
مؤلفون آخرون: School of Electrical and Electronic Engineering
التنسيق: Final Year Project
اللغة:English
منشور في: 2016
الموضوعات:
الوصول للمادة أونلاين:http://hdl.handle.net/10356/67994
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spelling sg-ntu-dr.10356-679942023-07-07T15:53:22Z Studies of gallium nitride high electron mobility transistors Goh, Basil Yan Kun School of Electrical and Electronic Engineering DRNTU::Engineering Gallium Nitride (GaN) is a Group III/V wide bandgap nitride-based material that possesses many unique properties, which pushes semiconductor device performances to newer limits. This has been attracting attention in both the engineering field and the commercial semiconductor industry. With the ability to achieve very high cut-off frequency, low noise figure and high power output density performance in fabricated devices, GaN is set to be one of the most advanced semiconductor materials for a wide spectrum of existing and new applications. With its unique highly polarization induced 2-Dimensional electron gas (2DEG), GaN-based High Electron Mobility Transistors (HEMTs) have been a focus in recent studies, aimed at improving and developing better fabrication techniques of devices for different appliances requiring highly linear power amplification or high temperature operations. Currently, many breakthroughs have been made in these areas, given the material’s considerably high dislocation density. It is already reported that integration of GaN on high resistivity Silicon (Si) substrate has achieved significant results - a step closer to materializing commercial large scaled fabrication of GaN HEMTs. In this report, GaN HEMTs will be introduced and areas of integration of GaN-on-Si will be looked into, namely the effects of fabrication conditions (low temperature annealing) as well as materials deposited along the process (non-gold). The report also includes an analysis of GaN technology as a whole, focusing on its compatibility with Complementary Metal-Oxide Semiconductor (CMOS) fabrication technology. Various samples fabricated under different conditions will be analyzed on their effects on the device performance. Bachelor of Engineering (Electrical and Electronic Engineering) A2131-151 2016-05-24T01:59:31Z 2016-05-24T01:59:31Z 2016 Final Year Project (FYP) http://hdl.handle.net/10356/67994 en 97 p. application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
language English
topic DRNTU::Engineering
spellingShingle DRNTU::Engineering
Goh, Basil Yan Kun
Studies of gallium nitride high electron mobility transistors
description Gallium Nitride (GaN) is a Group III/V wide bandgap nitride-based material that possesses many unique properties, which pushes semiconductor device performances to newer limits. This has been attracting attention in both the engineering field and the commercial semiconductor industry. With the ability to achieve very high cut-off frequency, low noise figure and high power output density performance in fabricated devices, GaN is set to be one of the most advanced semiconductor materials for a wide spectrum of existing and new applications. With its unique highly polarization induced 2-Dimensional electron gas (2DEG), GaN-based High Electron Mobility Transistors (HEMTs) have been a focus in recent studies, aimed at improving and developing better fabrication techniques of devices for different appliances requiring highly linear power amplification or high temperature operations. Currently, many breakthroughs have been made in these areas, given the material’s considerably high dislocation density. It is already reported that integration of GaN on high resistivity Silicon (Si) substrate has achieved significant results - a step closer to materializing commercial large scaled fabrication of GaN HEMTs. In this report, GaN HEMTs will be introduced and areas of integration of GaN-on-Si will be looked into, namely the effects of fabrication conditions (low temperature annealing) as well as materials deposited along the process (non-gold). The report also includes an analysis of GaN technology as a whole, focusing on its compatibility with Complementary Metal-Oxide Semiconductor (CMOS) fabrication technology. Various samples fabricated under different conditions will be analyzed on their effects on the device performance.
author2 School of Electrical and Electronic Engineering
author_facet School of Electrical and Electronic Engineering
Goh, Basil Yan Kun
format Final Year Project
author Goh, Basil Yan Kun
author_sort Goh, Basil Yan Kun
title Studies of gallium nitride high electron mobility transistors
title_short Studies of gallium nitride high electron mobility transistors
title_full Studies of gallium nitride high electron mobility transistors
title_fullStr Studies of gallium nitride high electron mobility transistors
title_full_unstemmed Studies of gallium nitride high electron mobility transistors
title_sort studies of gallium nitride high electron mobility transistors
publishDate 2016
url http://hdl.handle.net/10356/67994
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