Study of process responses, intermetallic formation and reliability of palladium-coated copper wire bonds
This thesis aims to address the knowledge gaps in terms of bondability, intermetallic formation and corrosion performance between palladium-coated Cu (Pd-Cu) and bare Cu wire bonds. The research specifically targets industrial fine pitch interconnect applications where a bonding wire (bare Cu and Pd...
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| Format: | Theses and Dissertations |
| Language: | English |
| Published: |
2016
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| Online Access: | https://hdl.handle.net/10356/68091 |
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| Institution: | Nanyang Technological University |
| Language: | English |