Study of process responses, intermetallic formation and reliability of palladium-coated copper wire bonds

This thesis aims to address the knowledge gaps in terms of bondability, intermetallic formation and corrosion performance between palladium-coated Cu (Pd-Cu) and bare Cu wire bonds. The research specifically targets industrial fine pitch interconnect applications where a bonding wire (bare Cu and Pd...

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Bibliographic Details
Main Author: Lim, Adeline Bee Yen
Other Authors: Chen Zhong
Format: Theses and Dissertations
Language:English
Published: 2016
Subjects:
Online Access:https://hdl.handle.net/10356/68091
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Institution: Nanyang Technological University
Language: English
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