Forced convection and sub-cooled flow boiling heat transfer from electronic chips

Forced convection and sub-cooled flow boiling heat transfer from electronic chips

Experiments are performed to study the single-phase forced convection heat transfer and subcooled flow boiling heat transfer from an in-line four simulated chips in a rectangular channel using water & FC-72.

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Bibliographic Details
Main Authors: Tou, Kwok Woon., Tso, Chih Ping.
Other Authors: School of Mechanical and Production Engineering
Format: Research Report
Published: 2008
Subjects:
DRNTU::Engineering::Materials::Microelectronics and semiconductor materials
Online Access:http://hdl.handle.net/10356/6902
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Institution: Nanyang Technological University
Description
Summary:Experiments are performed to study the single-phase forced convection heat transfer and subcooled flow boiling heat transfer from an in-line four simulated chips in a rectangular channel using water & FC-72.

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