Forced convection and sub-cooled flow boiling heat transfer from electronic chips

Experiments are performed to study the single-phase forced convection heat transfer and subcooled flow boiling heat transfer from an in-line four simulated chips in a rectangular channel using water & FC-72.

Saved in:

Bibliographic Details
Main Authors:	Tou, Kwok Woon., Tso, Chih Ping.
Other Authors:	School of Mechanical and Production Engineering
Format:	Research Report
Published:	2008
Subjects:	DRNTU::Engineering::Materials::Microelectronics and semiconductor materials
Online Access:	http://hdl.handle.net/10356/6902
Tags:	Add Tag No Tags, Be the first to tag this record!
Institution:	Nanyang Technological University

id	sg-ntu-dr.10356-6902
record_format	dspace
spelling	sg-ntu-dr.10356-69022020-06-01T10:44:39Z Forced convection and sub-cooled flow boiling heat transfer from electronic chips Tou, Kwok Woon. Tso, Chih Ping. School of Mechanical and Production Engineering DRNTU::Engineering::Materials::Microelectronics and semiconductor materials Experiments are performed to study the single-phase forced convection heat transfer and subcooled flow boiling heat transfer from an in-line four simulated chips in a rectangular channel using water & FC-72. 2008-09-17T14:36:38Z 2008-09-17T14:36:38Z 1999 1999 Research Report http://hdl.handle.net/10356/6902 Nanyang Technological University application/pdf
institution	Nanyang Technological University
building	NTU Library
country	Singapore
collection	DR-NTU
topic	DRNTU::Engineering::Materials::Microelectronics and semiconductor materials
spellingShingle	DRNTU::Engineering::Materials::Microelectronics and semiconductor materials Tou, Kwok Woon. Tso, Chih Ping. Forced convection and sub-cooled flow boiling heat transfer from electronic chips
description	Experiments are performed to study the single-phase forced convection heat transfer and subcooled flow boiling heat transfer from an in-line four simulated chips in a rectangular channel using water & FC-72.
author2	School of Mechanical and Production Engineering
author_facet	School of Mechanical and Production Engineering Tou, Kwok Woon. Tso, Chih Ping.
format	Research Report
author	Tou, Kwok Woon. Tso, Chih Ping.
author_sort	Tou, Kwok Woon.
title	Forced convection and sub-cooled flow boiling heat transfer from electronic chips
title_short	Forced convection and sub-cooled flow boiling heat transfer from electronic chips
title_full	Forced convection and sub-cooled flow boiling heat transfer from electronic chips
title_fullStr	Forced convection and sub-cooled flow boiling heat transfer from electronic chips
title_full_unstemmed	Forced convection and sub-cooled flow boiling heat transfer from electronic chips
title_sort	forced convection and sub-cooled flow boiling heat transfer from electronic chips
publishDate	2008
url	http://hdl.handle.net/10356/6902
_version_	1681059421718839296

Forced convection and sub-cooled flow boiling heat transfer from electronic chips

Similar Items