Forced convection and sub-cooled flow boiling heat transfer from electronic chips

• Main Authors: Tou, Kwok Woon., Tso, Chih Ping.
• Other Authors: School of Mechanical and Production Engineering
• Format: Research Report
• Published: 2008
• Subjects: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials
• Online Access: http://hdl.handle.net/10356/6902
• Institution: Nanyang Technological University

Experiments are performed to study the single-phase forced convection heat transfer and subcooled flow boiling heat transfer from an in-line four simulated chips in a rectangular channel using water & FC-72.