Design-for-reliability methodology for evaluation of lead-free solder performance in electronic packaging assemblies

• Main Author: Pang, John Hock Lye
• Other Authors: School of Mechanical and Production Engineering
• Format: Research Report
• Published: 2008
• Subjects: DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging
• Online Access: http://hdl.handle.net/10356/6968
• Institution: Nanyang Technological University

By 1st July 2006, legislations in the European Union (EU) will ban the use of lead (Pb) in all electronic products and this will effectively prohibit the use of tin-lead (Sn-Pb) solders and bring about a new paradigm shift in the technology and application of Lead-Free (Pb-free) electronic solders. Global consolidation in implementing Pb-free electronics manufacturing and reliable Pb-free electronic products has shifted the competitive edge of the industry to Pb-free readiness and competence. Solder technology is the key enabling technology for electrical interconnection in surface mounted integrated circuit (IC) components and printed circuit board (PCB) assemblies. A paradigm shift to Pb-free solders, soldering process, quality and reliability standards in electronic products, will have a major impact on Singapore's electronics manufacturing industry.