Design-for-reliability methodology for evaluation of lead-free solder performance in electronic packaging assemblies

• Main Author: Pang, John Hock Lye
• Other Authors: School of Mechanical and Production Engineering
• Format: Research Report
• Published: 2008
• Subjects: DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging
• Online Access: http://hdl.handle.net/10356/6968
• Institution: Nanyang Technological University

By 1st July 2006, legislations in the European Union (EU) will ban the use of lead (Pb) in all electronic products and this will effectively prohibit the use of tin-lead (Sn-Pb) solders and bring about a new paradigm shift in the technology and application of Lead-Free (Pb-free) electronic solders....