Development of polymeric microelectronics packaging encapsulation for harsh environment applications
Epoxy has been the choice of mainstream polymer encapsulation in electronics packaging since the 1960s. Many present electronic applications require polymer materials which are stronger mechanically and functions at higher temperature due to increasing operation demands. Research was previously cond...
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| 格式: | Thesis-Doctor of Philosophy |
| 語言: | English |
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Nanyang Technological University
2018
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| 主題: | |
| 在線閱讀: | http://hdl.handle.net/10356/73226 |
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