Formulation and characterization of micro/nano Cu paste for electronics bonding
Three-dimensional integrated circuits (3D-IC) technology was introduced to solve the interconnect delay and huge power dissipation problems found in two-dimensional integrated circuits (2D-IC). Copper is a popular material that is used for 3D-IC interconnection applications. Metallic pastes are used...
Saved in:
| Main Author: | |
|---|---|
| Other Authors: | |
| Format: | Final Year Project |
| Language: | English |
| Published: |
2018
|
| Subjects: | |
| Online Access: | http://hdl.handle.net/10356/74020 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| Institution: | Nanyang Technological University |
| Language: | English |