Advanced flip chip and wafer level packages for 2.5D and 3D IC package technology

• Main Author: Xu, Cheng
• Other Authors: Zhong Zhaowei
• Format: Theses and Dissertations
• Language: English
• Published: 2018
• Subjects: DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging; DRNTU::Engineering::Materials::Mechanical strength of materials
• Online Access: http://hdl.handle.net/10356/75893
• Institution: Nanyang Technological University

The demand of electronic product explodes in recent years, and the trend of electronic product is portable, multifunctional and budget currently. The fan-out wafer level packaging technology is a kind of wafer level packaging technology, and it becomes more and more attractive and popular because of...