Setup and implementation of hierarchical scan insertion using the core wrapping technique

The rapid shrinking of the technology node from deep submicron levels to 90nm and below has allowed the complexity of the designs to increase without significantly increasing the chip size. Large designs are now posing many challenges to all design disciplines including design-for-test (DFT). For a...

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Main Author: Saurabh, Maru
Other Authors: Gwee Bah Hwee
Format: Theses and Dissertations
Language:English
Published: 2018
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Online Access:http://hdl.handle.net/10356/76078
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Institution: Nanyang Technological University
Language: English
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spelling sg-ntu-dr.10356-760782023-07-04T15:41:30Z Setup and implementation of hierarchical scan insertion using the core wrapping technique Saurabh, Maru Gwee Bah Hwee Lin Zhiping School of Electrical and Electronic Engineering Technical University of Munich DRNTU::Engineering::Electrical and electronic engineering::Integrated circuits The rapid shrinking of the technology node from deep submicron levels to 90nm and below has allowed the complexity of the designs to increase without significantly increasing the chip size. Large designs are now posing many challenges to all design disciplines including design-for-test (DFT). For a System-on-Chip (SoC) with a few million flip-flops and multi-million gates, it has become extremely difficult to carry out DFT activities as full chip test pattern generation and simulation take enormous amount of time and computational resources, thereby decreasing the iterations in the entire design cycle. A hierarchical DFT methodology is employed, which helps in mitigating these problems by performing DFT activities like insertion of DFT logic, test pattern generation and simulation on a module (or IPs/Cores) rather than on the entire chip. To facilitate this, the modules/cores in the SoC are wrapped in such a way that testing of a module does not affect other modules and it itself is unaffected by the testing of other modules in the SoC. The patterns generated for the module are then retargeted from the SoC level. Core/module wrapping, scan chain insertion, automatic test pattern generation and pattern simulation are employed to implement this methodology. Mentor Graphics’ TessentScan is used for core wrapping and scan chain insertion while FastScan is used for generating test patterns. Cadence’s NCSim is used to simulate the test patterns. Employing this methodology has resulted in significant reduction in test pattern generation time and reduction in computational resources. This gain in time can now be utilized to analyze and improve the test coverage and focus on generating effective and fewer test patterns for lesser test time. Master of Science (Integrated Circuit Design) 2018-10-23T00:24:08Z 2018-10-23T00:24:08Z 2018 Thesis http://hdl.handle.net/10356/76078 en 81 p. application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
language English
topic DRNTU::Engineering::Electrical and electronic engineering::Integrated circuits
spellingShingle DRNTU::Engineering::Electrical and electronic engineering::Integrated circuits
Saurabh, Maru
Setup and implementation of hierarchical scan insertion using the core wrapping technique
description The rapid shrinking of the technology node from deep submicron levels to 90nm and below has allowed the complexity of the designs to increase without significantly increasing the chip size. Large designs are now posing many challenges to all design disciplines including design-for-test (DFT). For a System-on-Chip (SoC) with a few million flip-flops and multi-million gates, it has become extremely difficult to carry out DFT activities as full chip test pattern generation and simulation take enormous amount of time and computational resources, thereby decreasing the iterations in the entire design cycle. A hierarchical DFT methodology is employed, which helps in mitigating these problems by performing DFT activities like insertion of DFT logic, test pattern generation and simulation on a module (or IPs/Cores) rather than on the entire chip. To facilitate this, the modules/cores in the SoC are wrapped in such a way that testing of a module does not affect other modules and it itself is unaffected by the testing of other modules in the SoC. The patterns generated for the module are then retargeted from the SoC level. Core/module wrapping, scan chain insertion, automatic test pattern generation and pattern simulation are employed to implement this methodology. Mentor Graphics’ TessentScan is used for core wrapping and scan chain insertion while FastScan is used for generating test patterns. Cadence’s NCSim is used to simulate the test patterns. Employing this methodology has resulted in significant reduction in test pattern generation time and reduction in computational resources. This gain in time can now be utilized to analyze and improve the test coverage and focus on generating effective and fewer test patterns for lesser test time.
author2 Gwee Bah Hwee
author_facet Gwee Bah Hwee
Saurabh, Maru
format Theses and Dissertations
author Saurabh, Maru
author_sort Saurabh, Maru
title Setup and implementation of hierarchical scan insertion using the core wrapping technique
title_short Setup and implementation of hierarchical scan insertion using the core wrapping technique
title_full Setup and implementation of hierarchical scan insertion using the core wrapping technique
title_fullStr Setup and implementation of hierarchical scan insertion using the core wrapping technique
title_full_unstemmed Setup and implementation of hierarchical scan insertion using the core wrapping technique
title_sort setup and implementation of hierarchical scan insertion using the core wrapping technique
publishDate 2018
url http://hdl.handle.net/10356/76078
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