Influence of solid-state interfacial reactions on the tensile strength of Cu/electroless Ni–P/Sn–3.5Ag solder joint

• المؤلفون الرئيسيون: Kumar, Aditya, Chen, Zhong
• مؤلفون آخرون: School of Materials Science & Engineering
• التنسيق: مقال
• اللغة: English
• منشور في: 2013
• الموضوعات: DRNTU::Engineering::Materials
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/79900; http://hdl.handle.net/10220/9382

Tensile strength and fracture behavior of Cu/electroless Ni–P/Sn–3.5Ag (wt.% Ag) solder joint were investigated under high-temperature solid-state aging. The aging results showed that the Ni3Sn4 intermetallic phase grows at the electroless Ni–P/Sn–3.5Ag interface, along with the transformation of th...