Effect of electron beam treatment on adhesion of Ta/polymeric low-k interface

• المؤلفون الرئيسيون: Damayanti, M., Prasad, K., Chen, Zhe, Zhang, Sam, Jiang, Ning, Gan, Zhenghao, Chen, Zhong, Mhaisalkar, Subodh Gautam
• مؤلفون آخرون: School of Materials Science & Engineering
• التنسيق: مقال
• اللغة: English
• منشور في: 2012
• الموضوعات: DRNTU::Engineering::Materials
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/79990; http://hdl.handle.net/10220/7697

Reliability of the Cu/low-k structure is a serious concern since the metal/dielectric interface is generally weak. The adhesion of the Ta/polyarylene ether interfaces with and without electron beam (EB) treatment was investigated by four-point bending test, x-ray photoe...