Integration of CNTs in 3D-IC interconnects: a non-destructive approach for the precise characterization and elucidation of interfacial properties

• المؤلفون الرئيسيون: Ghosh, K., Verma, Y. K., Tan, Chuan Seng
• مؤلفون آخرون: School of Electrical and Electronic Engineering
• التنسيق: مقال
• اللغة: English
• منشور في: 2016
• الموضوعات: Electrical and Electronic Engineering
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/81430; http://hdl.handle.net/10220/40792

Having an array of novel functionalities and performance advantages, Multi-Walled Carbon Nanotubes (MWCNT) are one of the most promising nanomaterials to replace metals like copper and aluminum in the low-dimensional interconnects in three-dimensional (3D) integrated circuits (3D-IC) and sensors. Lo...