Integration of CNTs in 3D-IC interconnects: a non-destructive approach for the precise characterization and elucidation of interfacial properties
Having an array of novel functionalities and performance advantages, Multi-Walled Carbon Nanotubes (MWCNT) are one of the most promising nanomaterials to replace metals like copper and aluminum in the low-dimensional interconnects in three-dimensional (3D) integrated circuits (3D-IC) and sensors. Lo...
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| Main Authors: | , , |
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| Other Authors: | |
| Format: | Article |
| Language: | English |
| Published: |
2016
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| Subjects: | |
| Online Access: | https://hdl.handle.net/10356/81430 http://hdl.handle.net/10220/40792 |
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| Institution: | Nanyang Technological University |
| Language: | English |