Seal Integrity Testing Utilizing Non-Destructive Capacitive Sensing for Product Packaging Assurance

Seal Integrity Testing Utilizing Non-Destructive Capacitive Sensing for Product Packaging Assurance

10.1109/SENSORS47125.2020.9278879

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Bibliographic Details
Main Authors: JIEMING PAN, Li Yida, LUO YUXUAN, ZHANG XIANGYU, Zaifeng Yang, Wong Liang Tai,David, Niu Xuhua, Tham Chen Khong, THEAN VOON YEW, AARON
Other Authors: COLLEGE OF DESIGN AND ENGINEERING
Format: Conference or Workshop Item
Published: IEEE sensors 2022
Online Access:https://scholarbank.nus.edu.sg/handle/10635/218156
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Institution: National University of Singapore

Internet

https://scholarbank.nus.edu.sg/handle/10635/218156

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